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JNCASR Unveils 6G Silicon Chip With 100 Gbit/s Terahertz Transmission on Nov 4
Buzz Insights Desk3 min read

JNCASR researchers developed a silicon chip guiding terahertz waves past barriers at 100 Gbit/s, advancing future 6G wireless communication infrastructure.
What happened
Researchers at the Jawaharlal Nehru Centre for Advanced Scientific Research (JNCASR) announced on November 4, 2026, the development of a novel silicon chip that allows terahertz waves to pass through engineered barriers with minimal signal loss [2][15]. Sixth-generation (6G) wireless networks are expected to use terahertz frequencies, which offer wide bandwidth between microwaves and infrared light [2]. Guiding these waves through compact circuits has historically been difficult because bends, junctions, and changes in waveguides typically scatter or reflect signals [2].
Using topological photonics, the research team designed a silicon photonic crystal with triangular holes arranged in a honeycomb pattern resembling the lattice of graphene [2][15]. By changing the sizes of the triangular holes over a short section of the waveguide, they created an engineered barrier [2]. Testing showed that a single barrier added only about 1–2% loss, while two barriers in sequence resulted in about 2–3% loss, contrasting sharply with the severe signal reduction seen in conventional waveguides [2][15]. The study, published in the journalAdvanced Materials, was led by Dr. Abhishek Kumar, Assistant Professor at JNCASR's Meta Optics Laboratory [2][15].
Why it matters
The research team fabricated three devices on high-resistivity silicon, a material compatible with standard semiconductor manufacturing [2][15]: a waveguide with two consecutive barriers, an omega-shaped route featuring four sharp bends and a central barrier, and a power splitter with a barrier in one of its branches [2][15]. The double-barrier and omega-shaped devices achieved data speeds of 48 Gbit/s and 60 Gbit/s, respectively [2][15]. Furthermore, the power splitter supported transmission at 100 Gbit/s using QAM-32 modulation [2][15]. This level of performance points to compact terahertz circuits capable of routing and splitting high-speed data streams on a single chip, bringing future 6G wireless communication infrastructure closer to practical realization [2][15].
What to watch
The JNCASR research team plans to explore tuning the engineered barriers thermally, electrically, or mechanically [2]. Successful development of tunable barriers could allow future devices to dynamically redirect signals between different paths on demand, advancing the capabilities of single-chip terahertz communication systems [2].
Sources
Sources and evidence
- 1.Novel silicon chip allowing terahertz waves to pass through barriers could enable future 6G networks:
pib.gov.in · Primary source · 4 November 2026
- 2.New Silicon Chip Advances High-Speed 6G Technology | IBEF
ibef.org · 6 November 2026
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